APA (7th ed.) Citation

Yang, B., Sun, H., Zhu, K., & Wang, X. (2025). Double-Sided Fabrication of Low-Leakage-Current Through-Silicon Vias (TSVs) with High-Step-Coverage Liner/Barrier Layers. MDPI AG.

Chicago Style (17th ed.) Citation

Yang, Baoyan, Houjun Sun, Kaiqiang Zhu, and Xinghua Wang. Double-Sided Fabrication of Low-Leakage-Current Through-Silicon Vias (TSVs) with High-Step-Coverage Liner/Barrier Layers. MDPI AG, 2025.

MLA (9th ed.) Citation

Yang, Baoyan, et al. Double-Sided Fabrication of Low-Leakage-Current Through-Silicon Vias (TSVs) with High-Step-Coverage Liner/Barrier Layers. MDPI AG, 2025.