Ceramic based 3D integration technology of integrated navigation microsystem
In order to solve the problem of large volume and weight of high-precision integrated navigation system, a new 3D micro system packaging structure is proposed based on System in Package(SiP) technology such as multi-layer ceramic substrate, high-density wiring and 3D assembly. Using SIP processes su...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | Chinese |
| Published: |
National Computer System Engineering Research Institute of China
2025-04-01
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| Series: | Dianzi Jishu Yingyong |
| Subjects: | |
| Online Access: | http://www.chinaaet.com/article/3000171300 |
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