ZHANG, Y. (2015). Electromigration Failure Prediction and Reliability Evaluation of Solder Bumps for FCBGA package. Institute of Fundamental Technological Research.
Chicago Style (17th ed.) CitationZHANG, Yuanxiang. Electromigration Failure Prediction and Reliability Evaluation of Solder Bumps for FCBGA Package. Institute of Fundamental Technological Research, 2015.
MLA (9th ed.) CitationZHANG, Yuanxiang. Electromigration Failure Prediction and Reliability Evaluation of Solder Bumps for FCBGA Package. Institute of Fundamental Technological Research, 2015.
Warning: These citations may not always be 100% accurate.