Electromigration Failure Prediction and Reliability Evaluation of Solder Bumps for FCBGA package
Electromigration (EM) in solder joints under high current density has become a critical reliability issue for the future high density microelectronic packaging. A practical method of atomic density integral (ADI) for predicting solder bump electromigration reliability is proposed in this paper. The...
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| Main Author: | |
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| Format: | Article |
| Language: | English |
| Published: |
Institute of Fundamental Technological Research
2015-04-01
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| Series: | Engineering Transactions |
| Subjects: | |
| Online Access: | https://et.ippt.pan.pl/index.php/et/article/view/272 |
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