Sn–31Bi–19In alloy: A golden ratio design for exceptional elongation, high strength, and low-temperature soldering
Advanced semiconductor packaging demands low-temperature soldering and high soldering strength to mitigate thermal warpage challenges. This study developed the mechanical, thermal, and soldering properties of a novel Sn–Bi–In low-temperature alloy (LTA), designated as SBI3119, with a composition of...
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| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-07-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785425016102 |
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| Summary: | Advanced semiconductor packaging demands low-temperature soldering and high soldering strength to mitigate thermal warpage challenges. This study developed the mechanical, thermal, and soldering properties of a novel Sn–Bi–In low-temperature alloy (LTA), designated as SBI3119, with a composition of 50:30.9:19.1, inspired by the golden ratio, and evaluated its mechanical, thermal, and soldering properties. Tensile testing revealed an ultimate tensile strength (UTS) of 41.5 MPa and an exceptional elongation of 263 %, classifying SBI3119 as a room-temperature super-elongation LTA. The alloy exhibited an optimal balance of strength and ductility, attributable to its golden ratio-based design. Moreover, SBI3119 demonstrated a low transition temperature of 76 °C, a melting temperature of 150 ° C, excellent wettability (206 % spreading), and the formation of a thin Cu6(Sn, In)5 intermetallic interlayer when soldered with Cu. This facilitated successful soldering at 160 ° C and achieved a high soldering strength of 43.4 MPa. These findings suggest that SBI3119 is a promising candidate for advanced semiconductor packaging that requires high strength, ductility, and low-temperature soldering. |
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| ISSN: | 2238-7854 |