Sn–31Bi–19In alloy: A golden ratio design for exceptional elongation, high strength, and low-temperature soldering
Advanced semiconductor packaging demands low-temperature soldering and high soldering strength to mitigate thermal warpage challenges. This study developed the mechanical, thermal, and soldering properties of a novel Sn–Bi–In low-temperature alloy (LTA), designated as SBI3119, with a composition of...
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| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-07-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785425016102 |
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