Junction temperature prediction for multi-chip IGBT modules based on an improved 3D thermal network model and experimental results
Insulated Gate Bipolar Transistors (IGBTs) are extensively utilized in various industries due to their rapid switching capabilities and excellent high-voltage endurance. Multi-chip IGBT modules are essential components in high-power applications. However, the thermal coupling effects among chips wit...
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| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-09-01
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| Series: | Results in Engineering |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2590123025021449 |
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