Hybrid-Integrated Multi-Lines Optical-Phased-Array Chip
We propose a hybrid-integrated III–V-silicon optical-phased-array (OPA) based on passive alignment flip–chip bonding technology and provide new solutions for LiDAR. To achieve a large range of vertical beam steering in a hybrid-integrated OPA, a multi-lines OPA in a single chip is introduced. The sy...
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| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2025-07-01
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| Series: | Photonics |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2304-6732/12/7/699 |
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