A point cloud analysis method for high-voltage breakdown and creepage inside metal-encapsulated system-in-package
This paper combines high-precision modeling and graph theory ideas to establish a novel reliability analysis method, which provides a strong guarantee for product design and testing, for analyzing the potential risk of breakdown and creepage inside the high-voltage isolated system-in-package product...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | Chinese |
| Published: |
National Computer System Engineering Research Institute of China
2024-02-01
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| Series: | Dianzi Jishu Yingyong |
| Subjects: | |
| Online Access: | http://www.chinaaet.com/article/3000163476 |
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| _version_ | 1839651630660714496 |
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| author | Wang Lu Bai Han Zeng Yanping Ding Taojie |
| author_facet | Wang Lu Bai Han Zeng Yanping Ding Taojie |
| author_sort | Wang Lu |
| collection | DOAJ |
| description | This paper combines high-precision modeling and graph theory ideas to establish a novel reliability analysis method, which provides a strong guarantee for product design and testing, for analyzing the potential risk of breakdown and creepage inside the high-voltage isolated system-in-package products. Firstly, the 3D model of the product is converted into a point cloud model, and a computable numerical model is formed through filtering and surface reconstruction. Then, according to the geometric characteristics and physical relations, the surface creepage problem and breakdown problem are equivalent to the calculation of geodesic path and Euclidean path, respectively. According to the layout, the Dijkstra algorithm is optimized to calculate the breakdown and creepage paths after packaging. Finally, the product risk level is judged by reference to the experimental standards. |
| format | Article |
| id | doaj-art-3efa9bb68d1e48bbb03f9de41b19fba0 |
| institution | Matheson Library |
| issn | 0258-7998 |
| language | zho |
| publishDate | 2024-02-01 |
| publisher | National Computer System Engineering Research Institute of China |
| record_format | Article |
| series | Dianzi Jishu Yingyong |
| spelling | doaj-art-3efa9bb68d1e48bbb03f9de41b19fba02025-06-26T02:12:08ZzhoNational Computer System Engineering Research Institute of ChinaDianzi Jishu Yingyong0258-79982024-02-01502384210.16157/j.issn.0258-7998.2342553000163476A point cloud analysis method for high-voltage breakdown and creepage inside metal-encapsulated system-in-packageWang Lu0Bai Han1Zeng Yanping2Ding Taojie3The 58th Research Institute of China Electronics Technology Group Corporation， Wuxi 214000， ChinaThe 58th Research Institute of China Electronics Technology Group Corporation， Wuxi 214000， ChinaThe 58th Research Institute of China Electronics Technology Group Corporation， Wuxi 214000， ChinaThe 58th Research Institute of China Electronics Technology Group Corporation， Wuxi 214000， ChinaThis paper combines high-precision modeling and graph theory ideas to establish a novel reliability analysis method, which provides a strong guarantee for product design and testing, for analyzing the potential risk of breakdown and creepage inside the high-voltage isolated system-in-package products. Firstly, the 3D model of the product is converted into a point cloud model, and a computable numerical model is formed through filtering and surface reconstruction. Then, according to the geometric characteristics and physical relations, the surface creepage problem and breakdown problem are equivalent to the calculation of geodesic path and Euclidean path, respectively. According to the layout, the Dijkstra algorithm is optimized to calculate the breakdown and creepage paths after packaging. Finally, the product risk level is judged by reference to the experimental standards.http://www.chinaaet.com/article/3000163476system-in-packagepoint cloud analysisdijkstra algorithmhigh-voltage breakdownhigh-voltage creepage |
| spellingShingle | Wang Lu Bai Han Zeng Yanping Ding Taojie A point cloud analysis method for high-voltage breakdown and creepage inside metal-encapsulated system-in-package Dianzi Jishu Yingyong system-in-package point cloud analysis dijkstra algorithm high-voltage breakdown high-voltage creepage |
| title | A point cloud analysis method for high-voltage breakdown and creepage inside metal-encapsulated system-in-package |
| title_full | A point cloud analysis method for high-voltage breakdown and creepage inside metal-encapsulated system-in-package |
| title_fullStr | A point cloud analysis method for high-voltage breakdown and creepage inside metal-encapsulated system-in-package |
| title_full_unstemmed | A point cloud analysis method for high-voltage breakdown and creepage inside metal-encapsulated system-in-package |
| title_short | A point cloud analysis method for high-voltage breakdown and creepage inside metal-encapsulated system-in-package |
| title_sort | point cloud analysis method for high voltage breakdown and creepage inside metal encapsulated system in package |
| topic | system-in-package point cloud analysis dijkstra algorithm high-voltage breakdown high-voltage creepage |
| url | http://www.chinaaet.com/article/3000163476 |
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