A point cloud analysis method for high-voltage breakdown and creepage inside metal-encapsulated system-in-package
This paper combines high-precision modeling and graph theory ideas to establish a novel reliability analysis method, which provides a strong guarantee for product design and testing, for analyzing the potential risk of breakdown and creepage inside the high-voltage isolated system-in-package product...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | Chinese |
| Published: |
National Computer System Engineering Research Institute of China
2024-02-01
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| Series: | Dianzi Jishu Yingyong |
| Subjects: | |
| Online Access: | http://www.chinaaet.com/article/3000163476 |
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