Lu, W., Han, B., Yanping, Z., & Taojie, D. (2024). A point cloud analysis method for high-voltage breakdown and creepage inside metal-encapsulated system-in-package. National Computer System Engineering Research Institute of China.
Chicago Style (17th ed.) CitationLu, Wang, Bai Han, Zeng Yanping, and Ding Taojie. A Point Cloud Analysis Method for High-voltage Breakdown and Creepage Inside Metal-encapsulated System-in-package. National Computer System Engineering Research Institute of China, 2024.
MLA (9th ed.) CitationLu, Wang, et al. A Point Cloud Analysis Method for High-voltage Breakdown and Creepage Inside Metal-encapsulated System-in-package. National Computer System Engineering Research Institute of China, 2024.
Warning: These citations may not always be 100% accurate.