Understanding the Influence of Aging Time on the Eutectic Growth of Sn-xBi Solder Alloys
In order to support new packaging technologies driven by new demands for rapid data communication in 5G and IoT (Internet of Things), as well as prevent issues related to thermal expansion and deformation. Studies aimed at understanding the effect of temperature and time during service life of solde...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Associação Brasileira de Metalurgia e Materiais (ABM); Associação Brasileira de Cerâmica (ABC); Associação Brasileira de Polímeros (ABPol)
2025-07-01
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| Series: | Materials Research |
| Subjects: | |
| Online Access: | http://www.scielo.br/scielo.php?script=sci_arttext&pid=S1516-14392025000100267&lng=en&tlng=en |
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