Laser Written Glass Interposer for Fiber Coupling to Silicon Photonic Integrated Circuits
Recent advancements in photonic-electronic integration push towards denser multichannel fiber to silicon photonic chip coupling solutions. However, current packaging schemes based on suitably polished fiber arrays do not provide sufficient scalability. Alternatively, lithographically-patterned fused...
Saved in:
| Main Authors: | , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
IEEE
2021-01-01
|
| Series: | IEEE Photonics Journal |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/9269385/ |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|