Photoelastic Refractive Index Changes in GaAs Investigated by Finite Element Method (FEM) Simulations

Changes in the refractive indices of a GaAs laser chip owing to bonding strain are investigated by two-dimensional (2D) and three-dimensional (3D) finite element method (FEM) simulations. The strain induced by die attach (i.e., the bonding strain) was estimated by fitting simulations to the measured...

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Bibliografiset tiedot
Päätekijä: Daniel T. Cassidy
Aineistotyyppi: Artikkeli
Kieli:englanti
Julkaistu: MDPI AG 2025-05-01
Sarja:Optics
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Linkit:https://www.mdpi.com/2673-3269/6/2/21
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