Investigation of the profilogram structure of microstrip microwave modules manufactured using additive 3D-printing technology
Objectives. The aim of the work is to study the surface roughness of the current-carrying topology and dielectric of the upper (Top Layer) and lower (Bottom Layer) sides of microwave modules manufactured using additive three-dimensional printing technology when prototyping prototypes of microwave mo...
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| Main Authors: | , |
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| Format: | Article |
| Language: | Russian |
| Published: |
MIREA - Russian Technological University
2023-10-01
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| Series: | Российский технологический журнал |
| Subjects: | |
| Online Access: | https://www.rtj-mirea.ru/jour/article/view/761 |
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