TECHNOLOGY OF LASER CUTTING OF SILICON WAFERS INTO ORGANIC LIGHT-EMITTING DIODE CHIPS

TECHNOLOGY OF LASER CUTTING OF SILICON WAFERS INTO ORGANIC LIGHT-EMITTING DIODE CHIPS

The article deals with the matter of crystal quality in the production of microdisplays based on organic light-emitting diodes (OLEDs) after separation. This work aimed at increasing the product yield in cutting a silicon device wafer into chips by a method based on laser controlled thermocracking (...

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Bibliographic Details
Main Authors: V. S. Kondratenko, V. I. Ivanov
Format: Article
Language:Russian
Published: MIREA - Russian Technological University 2016-06-01
Series:Российский технологический журнал
Subjects:
ferroelectric
thin film
pzt
modeling
disturbed layer
dead layer
Online Access:https://www.rtj-mirea.ru/jour/article/view/20
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