-enhanced zinc aluminate microwave dielectric ceramics for electronic packaging to thermally match printed circuit boards
With the rapid development of electronic integration technology, highly integrated chips are in urgent need of packaging materials that are thermally matched to printed circuit boards. Here, [Formula: see text]CoxAl2O4 (ZCAO, x= 0.00–0.20) ceramics are synthesized using the solid-state reaction meth...
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| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
World Scientific Publishing
2025-06-01
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| Series: | Journal of Advanced Dielectrics |
| Subjects: | |
| Online Access: | https://www.worldscientific.com/doi/10.1142/S2010135X24500280 |
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