Integration of Electrografted Layers for the Metallization of Deep Through Silicon Vias

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Integration of Electrografted Layers for the Metallization of Deep Through Silicon Vias

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Библиографические подробности
Главный автор:	Raynal, Frederic
Формат:	Электронный ресурс Глава книги
Язык:	английский
Опубликовано:	IntechOpen 2012
Предметы:	Physical Sciences, Engineering and Technology
Online-ссылка:	https://www.intechopen.com/chapters/35384
Метки:	Добавить метку Нет меток, Требуется 1-ая метка записи!

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