Material Characterization and Failure Analysis for Microelectronics Assembly Processes
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| Main Authors: | , , , , |
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| Format: | Electronic Book Chapter |
| Language: | English |
| Published: |
IntechOpen
2011
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| Online Access: | https://www.intechopen.com/chapters/23751 |
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| _version_ | 1839563757463797760 |
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| author | Huang, Chien-Yi Li, Ming-Shu Huang, Shan-Yu Chang, Cheng-I Huang, Min-Hui |
| author_facet | Huang, Chien-Yi Li, Ming-Shu Huang, Shan-Yu Chang, Cheng-I Huang, Min-Hui |
| author_sort | Huang, Chien-Yi |
| collection | InTech Open eBooks |
| description | None |
| doi_str_mv | 10.5772/23532 |
| first_indexed | 2025-08-04T21:58:28Z |
| format | Electronic Book Chapter |
| fullrecord | <oai_dc:dc xmlns:oai_dc="http://www.openarchives.org/OAI/2.0/oai_dc/" xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xsi:schemaLocation="http://www.openarchives.org/OAI/2.0/oai_dc/ http://www.openarchives.org/OAI/2.0/oai_dc.xsd"><identifier>InTech-23751</identifier><datestamp>2011-11-09</datestamp>
<dc:title>Material Characterization and Failure Analysis for Microelectronics Assembly Processes</dc:title>
<dc:creator>Chien-Yi Huang</dc:creator>
<dc:creator>Ming-Shu Li</dc:creator>
<dc:creator>Shan-Yu Huang</dc:creator>
<dc:creator>Cheng-I Chang</dc:creator>
<dc:creator>Min-Hui Huang</dc:creator>
<dc:subject>Physical Sciences, Engineering and Technology</dc:subject>
<dc:description>None</dc:description>
<dc:publisher>IntechOpen</dc:publisher>
<dc:date>2011-11-09</dc:date>
<dc:type>Chapter, Part Of Book</dc:type>
<dc:identifier>https://www.intechopen.com/chapters/23751</dc:identifier>
<dc:identifier>doi:10.5772/23532</dc:identifier>
<dc:language>en</dc:language>
<dc:relation>ISBN:978-953-307-683-6</dc:relation>
<dc:rights>https://creativecommons.org/licenses/by/3.0/</dc:rights>
<dc:source>https://www.intechopen.com/books/632 ; Wide Spectra of Quality Control</dc:source>
</oai_dc:dc> |
| id | InTech-23751 |
| institution | Matheson Library |
| isbn | 978-953-307-683-6 |
| language | English |
| last_indexed | 2025-08-04T21:58:28Z |
| publishDate | 2011 |
| publisher | IntechOpen |
| record_format | intech |
| spelling | InTech-237512011-11-09 Material Characterization and Failure Analysis for Microelectronics Assembly Processes Chien-Yi Huang Ming-Shu Li Shan-Yu Huang Cheng-I Chang Min-Hui Huang Physical Sciences, Engineering and Technology None IntechOpen 2011-11-09 Chapter, Part Of Book https://www.intechopen.com/chapters/23751 doi:10.5772/23532 en ISBN:978-953-307-683-6 https://creativecommons.org/licenses/by/3.0/ https://www.intechopen.com/books/632 ; Wide Spectra of Quality Control |
| spellingShingle | Physical Sciences, Engineering and Technology Huang, Chien-Yi Li, Ming-Shu Huang, Shan-Yu Chang, Cheng-I Huang, Min-Hui Material Characterization and Failure Analysis for Microelectronics Assembly Processes |
| title | Material Characterization and Failure Analysis for Microelectronics Assembly Processes |
| title_full | Material Characterization and Failure Analysis for Microelectronics Assembly Processes |
| title_fullStr | Material Characterization and Failure Analysis for Microelectronics Assembly Processes |
| title_full_unstemmed | Material Characterization and Failure Analysis for Microelectronics Assembly Processes |
| title_short | Material Characterization and Failure Analysis for Microelectronics Assembly Processes |
| title_sort | material characterization and failure analysis for microelectronics assembly processes |
| topic | Physical Sciences, Engineering and Technology |
| url | https://www.intechopen.com/chapters/23751 |
| work_keys_str_mv | AT huangchienyi materialcharacterizationandfailureanalysisformicroelectronicsassemblyprocesses AT limingshu materialcharacterizationandfailureanalysisformicroelectronicsassemblyprocesses AT huangshanyu materialcharacterizationandfailureanalysisformicroelectronicsassemblyprocesses AT changchengi materialcharacterizationandfailureanalysisformicroelectronicsassemblyprocesses AT huangminhui materialcharacterizationandfailureanalysisformicroelectronicsassemblyprocesses |