Material Characterization and Failure Analysis for Microelectronics Assembly Processes

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Bibliographic Details
Main Authors:	Huang, Chien-Yi, Li, Ming-Shu, Huang, Shan-Yu, Chang, Cheng-I, Huang, Min-Hui
Format:	Electronic Book Chapter
Language:	English
Published:	IntechOpen 2011
Subjects:	Physical Sciences, Engineering and Technology
Online Access:	https://www.intechopen.com/chapters/23751
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