Huang, C., Li, M., Huang, S., Chang, C., & Huang, M. (2011). Material Characterization and Failure Analysis for Microelectronics Assembly Processes. IntechOpen. https://doi.org/10.5772/23532
Chicago Style (17th ed.) CitationHuang, Chien-Yi, Ming-Shu Li, Shan-Yu Huang, Cheng-I Chang, and Min-Hui Huang. Material Characterization and Failure Analysis for Microelectronics Assembly Processes. IntechOpen, 2011. https://doi.org/10.5772/23532.
MLA (9th ed.) CitationHuang, Chien-Yi, et al. Material Characterization and Failure Analysis for Microelectronics Assembly Processes. IntechOpen, 2011. https://doi.org/10.5772/23532.
Warning: These citations may not always be 100% accurate.