Mass Transfer Within the Location Where Micro Electroplating Takes Place
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| Main Authors: | , , , , |
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| Format: | Electronic Book Chapter |
| Language: | English |
| Published: |
IntechOpen
2011
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| Subjects: | |
| Online Access: | https://www.intechopen.com/chapters/23519 |
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| _version_ | 1839564778235756544 |
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| author | Lin, Jing-Chie Chang, Ting-Kang Yang, Jen-Horn Hwang, Yean-Ren Li, Chuan |
| author_facet | Lin, Jing-Chie Chang, Ting-Kang Yang, Jen-Horn Hwang, Yean-Ren Li, Chuan |
| author_sort | Lin, Jing-Chie |
| collection | InTech Open eBooks |
| description | None |
| doi_str_mv | 10.5772/21384 |
| first_indexed | 2025-08-04T22:14:42Z |
| format | Electronic Book Chapter |
| fullrecord | <oai_dc:dc xmlns:oai_dc="http://www.openarchives.org/OAI/2.0/oai_dc/" xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xsi:schemaLocation="http://www.openarchives.org/OAI/2.0/oai_dc/ http://www.openarchives.org/OAI/2.0/oai_dc.xsd"><identifier>InTech-23519</identifier><datestamp>2011-11-04</datestamp>
<dc:title>Mass Transfer Within the Location Where Micro Electroplating Takes Place</dc:title>
<dc:creator>Jing-Chie Lin</dc:creator>
<dc:creator>Ting-Kang Chang</dc:creator>
<dc:creator>Jen-Horn Yang</dc:creator>
<dc:creator>Yean-Ren Hwang</dc:creator>
<dc:creator>Chuan Li</dc:creator>
<dc:subject>Physical Sciences, Engineering and Technology</dc:subject>
<dc:description>None</dc:description>
<dc:publisher>IntechOpen</dc:publisher>
<dc:date>2011-11-04</dc:date>
<dc:type>Chapter, Part Of Book</dc:type>
<dc:identifier>https://www.intechopen.com/chapters/23519</dc:identifier>
<dc:identifier>doi:10.5772/21384</dc:identifier>
<dc:language>en</dc:language>
<dc:relation>ISBN:978-953-307-636-2</dc:relation>
<dc:rights>https://creativecommons.org/licenses/by/3.0/</dc:rights>
<dc:source>https://www.intechopen.com/books/925 ; Mass Transfer - Advanced Aspects</dc:source>
</oai_dc:dc> |
| id | InTech-23519 |
| institution | Matheson Library |
| isbn | 978-953-307-636-2 |
| language | English |
| last_indexed | 2025-08-04T22:14:42Z |
| publishDate | 2011 |
| publisher | IntechOpen |
| record_format | intech |
| spelling | InTech-235192011-11-04 Mass Transfer Within the Location Where Micro Electroplating Takes Place Jing-Chie Lin Ting-Kang Chang Jen-Horn Yang Yean-Ren Hwang Chuan Li Physical Sciences, Engineering and Technology None IntechOpen 2011-11-04 Chapter, Part Of Book https://www.intechopen.com/chapters/23519 doi:10.5772/21384 en ISBN:978-953-307-636-2 https://creativecommons.org/licenses/by/3.0/ https://www.intechopen.com/books/925 ; Mass Transfer - Advanced Aspects |
| spellingShingle | Physical Sciences, Engineering and Technology Lin, Jing-Chie Chang, Ting-Kang Yang, Jen-Horn Hwang, Yean-Ren Li, Chuan Mass Transfer Within the Location Where Micro Electroplating Takes Place |
| title | Mass Transfer Within the Location Where Micro Electroplating Takes Place |
| title_full | Mass Transfer Within the Location Where Micro Electroplating Takes Place |
| title_fullStr | Mass Transfer Within the Location Where Micro Electroplating Takes Place |
| title_full_unstemmed | Mass Transfer Within the Location Where Micro Electroplating Takes Place |
| title_short | Mass Transfer Within the Location Where Micro Electroplating Takes Place |
| title_sort | mass transfer within the location where micro electroplating takes place |
| topic | Physical Sciences, Engineering and Technology |
| url | https://www.intechopen.com/chapters/23519 |
| work_keys_str_mv | AT linjingchie masstransferwithinthelocationwheremicroelectroplatingtakesplace AT changtingkang masstransferwithinthelocationwheremicroelectroplatingtakesplace AT yangjenhorn masstransferwithinthelocationwheremicroelectroplatingtakesplace AT hwangyeanren masstransferwithinthelocationwheremicroelectroplatingtakesplace AT lichuan masstransferwithinthelocationwheremicroelectroplatingtakesplace |