A Closed-Form Solution for the Transient Heat and Moisture Diffusion in a Double-Layer Plate

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I tiakina i:
Ngā taipitopito rārangi puna kōrero
Kaituhi matua: Chiba, Ryoichi
Hōputu: Tāhiko Wāhanga pukapuka
Reo:Ingarihi
I whakaputaina: IntechOpen 2011
Ngā marau:
Urunga tuihono:https://www.intechopen.com/chapters/13431
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