Search Results - "system in package（sip）"

The designation of solid state drive circuit based on SiP technology by Yang Chuwei, Zhang Meijuan, Shen Qing

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Ceramic based 3D integration technology of integrated navigation microsystem by Shen Shijun, He Yilei, Wang Jinhua, Zhuang Yonghe

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Reliability analysis based on cascaded-Foster thermal networks for systems-in-package (SiP) by Djallel Eddine Touati, Aziz Oukaira, Mohamed Ali, Ahmad Hassan, Yvon Savaria, Ahmed Lakhssassi

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Thermal Analysis of System in Package Considering Boundary Conditions for Long-Term Reliability Studies by Djallel Eddine Touati, Aziz Oukaira, Ahmad Hassan, Mohamed Ali, Yvon Savaria, Ahmed Lakhssassi

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