Strain engineering of microfabricated diamond and its applications
Diamond is considered the ultimate semiconductor material due to its excellent physical and electrical properties, such as ultrahigh thermal conductivity, ultrawide bandgap, and superhigh carrier mobility. After ultralarge deformation experimentally conducted on diamond in 2018 and 2021, strain engi...
Saved in:
| Main Authors: | , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
AIP Publishing LLC
2025-06-01
|
| Series: | APL Materials |
| Online Access: | http://dx.doi.org/10.1063/5.0268185 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| _version_ | 1839642011000373248 |
|---|---|
| author | Wenjun Liang Limin Yang Jiaqi Zhu Yiling Lian Yang Lu |
| author_facet | Wenjun Liang Limin Yang Jiaqi Zhu Yiling Lian Yang Lu |
| author_sort | Wenjun Liang |
| collection | DOAJ |
| description | Diamond is considered the ultimate semiconductor material due to its excellent physical and electrical properties, such as ultrahigh thermal conductivity, ultrawide bandgap, and superhigh carrier mobility. After ultralarge deformation experimentally conducted on diamond in 2018 and 2021, strain engineering is a highly appealing candidate for tuning these properties of diamond, opening up potential applications in microelectronics and quantum technologies. In this review, we briefly review the implementation of strain engineering on diamond, including introducing dynamic strain by nanomechanical tests and maintaining static strain by various methods. We also provide a brief overview of the strain-induced property changes and the specific applications of the strained diamond. |
| format | Article |
| id | doaj-art-ddda4fb3cbf74d308d0bfd4c99ef9cb1 |
| institution | Matheson Library |
| issn | 2166-532X |
| language | English |
| publishDate | 2025-06-01 |
| publisher | AIP Publishing LLC |
| record_format | Article |
| series | APL Materials |
| spelling | doaj-art-ddda4fb3cbf74d308d0bfd4c99ef9cb12025-07-02T17:45:54ZengAIP Publishing LLCAPL Materials2166-532X2025-06-01136060602060602-1210.1063/5.0268185Strain engineering of microfabricated diamond and its applicationsWenjun Liang0Limin Yang1Jiaqi Zhu2Yiling Lian3Yang Lu4Department of Mechanical Engineering, The University of Hong Kong, Hong Kong, ChinaDepartment of Mechanical Engineering, City University of Hong Kong, Hong Kong, ChinaDepartment of Mechanical Engineering, The University of Hong Kong, Hong Kong, ChinaDepartment of Mechanical Engineering, The University of Hong Kong, Hong Kong, ChinaDepartment of Mechanical Engineering, The University of Hong Kong, Hong Kong, ChinaDiamond is considered the ultimate semiconductor material due to its excellent physical and electrical properties, such as ultrahigh thermal conductivity, ultrawide bandgap, and superhigh carrier mobility. After ultralarge deformation experimentally conducted on diamond in 2018 and 2021, strain engineering is a highly appealing candidate for tuning these properties of diamond, opening up potential applications in microelectronics and quantum technologies. In this review, we briefly review the implementation of strain engineering on diamond, including introducing dynamic strain by nanomechanical tests and maintaining static strain by various methods. We also provide a brief overview of the strain-induced property changes and the specific applications of the strained diamond.http://dx.doi.org/10.1063/5.0268185 |
| spellingShingle | Wenjun Liang Limin Yang Jiaqi Zhu Yiling Lian Yang Lu Strain engineering of microfabricated diamond and its applications APL Materials |
| title | Strain engineering of microfabricated diamond and its applications |
| title_full | Strain engineering of microfabricated diamond and its applications |
| title_fullStr | Strain engineering of microfabricated diamond and its applications |
| title_full_unstemmed | Strain engineering of microfabricated diamond and its applications |
| title_short | Strain engineering of microfabricated diamond and its applications |
| title_sort | strain engineering of microfabricated diamond and its applications |
| url | http://dx.doi.org/10.1063/5.0268185 |
| work_keys_str_mv | AT wenjunliang strainengineeringofmicrofabricateddiamondanditsapplications AT liminyang strainengineeringofmicrofabricateddiamondanditsapplications AT jiaqizhu strainengineeringofmicrofabricateddiamondanditsapplications AT yilinglian strainengineeringofmicrofabricateddiamondanditsapplications AT yanglu strainengineeringofmicrofabricateddiamondanditsapplications |