Cui, K., Wang, Y., Yan, W., Cao, T., Du, Y., Wu, K., & Guo, L. (2025). Investigation on the Underlying Mechanisms of the Mechanical and Electrical Enhancement of Nano-SiO<sub>2</sub>-Doped Epoxy Resins: A Molecular Simulation Study. MDPI AG.
Chicago Style (17th ed.) CitationCui, Kunqi, Yang Wang, Wenchao Yan, Teng Cao, Yan Du, Kai Wu, and Li Guo. Investigation on the Underlying Mechanisms of the Mechanical and Electrical Enhancement of Nano-SiO<sub>2</sub>-Doped Epoxy Resins: A Molecular Simulation Study. MDPI AG, 2025.
MLA (9th ed.) CitationCui, Kunqi, et al. Investigation on the Underlying Mechanisms of the Mechanical and Electrical Enhancement of Nano-SiO<sub>2</sub>-Doped Epoxy Resins: A Molecular Simulation Study. MDPI AG, 2025.
Warning: These citations may not always be 100% accurate.