High-<inline-formula><tex-math notation="LaTeX">$Q$</tex-math></inline-formula> Bound State in the Continuum Cavity Enabled by High-Order Topological Charge

We propose and demonstrate a high-quality (<inline-formula><tex-math notation="LaTeX">$Q$</tex-math></inline-formula>) bound state in the continuum (BIC) cavity based on a hexagonal lattice photonic crystal (PhC) slab with <inline-formula><tex-math notation...

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Bibliographic Details
Main Authors: Zhao Zheng, Ye Chen, Feifan Wang, Yi Zuo, Xiaoyu Zhang, Peishen Li, Zihao Chen, Zhiyuan Qian, Zixuan Zhang, Chao Peng
Format: Article
Language:English
Published: IEEE 2024-01-01
Series:IEEE Photonics Journal
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Online Access:https://ieeexplore.ieee.org/document/10521730/
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Summary:We propose and demonstrate a high-quality (<inline-formula><tex-math notation="LaTeX">$Q$</tex-math></inline-formula>) bound state in the continuum (BIC) cavity based on a hexagonal lattice photonic crystal (PhC) slab with <inline-formula><tex-math notation="LaTeX">$C_{6}$</tex-math></inline-formula> symmetry, which carries high-order topological charges of <inline-formula><tex-math notation="LaTeX">$q=-\text{2}$</tex-math></inline-formula>. By combining the lateral photonic bandgap and high-order topological charge, we realize a <inline-formula><tex-math notation="LaTeX">$Q$</tex-math></inline-formula> of <inline-formula><tex-math notation="LaTeX">$\text{7}\times \text{10}^{4}$</tex-math></inline-formula> in the experiment which is several times higher than traditional BIC cavities with topological charge of <inline-formula><tex-math notation="LaTeX">$q=\pm\text{1}$</tex-math></inline-formula>. Specifically, we found that the boundary orientation would significantly influence the performance of lateral confinement. In contrast to an X direction boundary, a gradient J direction boundary can best alleviate the shortcoming of lateral leakage due to incomplete bandgap and the scattering because of momentum mismatching, and relax the strict constraints on wafer thickness. Our findings could broaden the application of BIC cavities from bio-sensing to on-chip telecommunication.
ISSN:1943-0655