Direct Strong Acid Copper Plating on Steel Substrate without Pre - Plating

The acid copper plating on steel substrate required pre-plating to ensure the adhesion between coating and substrate, which not only increased the process flow but also increased the resource consumption. By introducing surface active substances, a process for direct strong acid copper plating on st...

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Bibliographic Details
Main Author: ZHANG Zhi-liang, ZHANG Ying
Format: Article
Language:Chinese
Published: Editorial Department of Materials Protection 2021-07-01
Series:Cailiao Baohu
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Online Access:http://www.mat-pro.com/fileup/1001-1560/PDF/20210715.pdf
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Summary:The acid copper plating on steel substrate required pre-plating to ensure the adhesion between coating and substrate, which not only increased the process flow but also increased the resource consumption. By introducing surface active substances, a process for direct strong acid copper plating on steel substrate was developed, which could be used for direct strong acid copper plating on steel substrate without pre-plating. From the test results, the coating prepared by this process had good adhesion, its adhesion to the substrate could meet the requirements of product performance. The reason why this process could directly conduct copper plating on the steel substrate in strong acidic environment was that the strong surface-active substances was combined in the additive, so that the replacement of copper ions and iron atoms could be carried out orderly, thus ensuring the adhesion between the copper coating and the steel substrate.
ISSN:1001-1560