Mun, J., Kang, J., Zheng, Y., Luo, S., Wu, Y., Gong, H., . . . Bao, Z. (2020). F4‐TCNQ as an Additive to Impart Stretchable Semiconductors with High Mobility and Stability. Wiley-VCH.
Chicago Style (17th ed.) CitationMun, Jaewan, et al. F4‐TCNQ as an Additive to Impart Stretchable Semiconductors with High Mobility and Stability. Wiley-VCH, 2020.
MLA (9th ed.) CitationMun, Jaewan, et al. F4‐TCNQ as an Additive to Impart Stretchable Semiconductors with High Mobility and Stability. Wiley-VCH, 2020.
Warning: These citations may not always be 100% accurate.