Chen, S., & Lei, H. (2025). Improvement in the planarization of 4H-SiC(0001) achieved by photo-assisted chemical mechanical polishing (P-CMP) using nano TiO2-based composite abrasive with heterostructure. Tsinghua University Press.
Chicago Style (17th ed.) CitationChen, Shidong, and Hong Lei. Improvement in the Planarization of 4H-SiC(0001) Achieved by Photo-assisted Chemical Mechanical Polishing (P-CMP) Using Nano TiO2-based Composite Abrasive with Heterostructure. Tsinghua University Press, 2025.
MLA (9th ed.) CitationChen, Shidong, and Hong Lei. Improvement in the Planarization of 4H-SiC(0001) Achieved by Photo-assisted Chemical Mechanical Polishing (P-CMP) Using Nano TiO2-based Composite Abrasive with Heterostructure. Tsinghua University Press, 2025.
Warning: These citations may not always be 100% accurate.