APA (7th ed.) Citation

Pilipenka, U. A., Saladukha, V. A., Siarheichyk, H. A., & Shestouski, D. U. (2024). Impact Produced by Recrystallization of Mechanically Destroyed Layer on Planar Side of Silicon Wafer Upon Electrical Parameters of CMOS Microcircuits. Educational institution «Belarusian State University of Informatics and Radioelectronics».

Chicago Style (17th ed.) Citation

Pilipenka, U. A., V. A. Saladukha, H. A. Siarheichyk, and D. U. Shestouski. Impact Produced by Recrystallization of Mechanically Destroyed Layer on Planar Side of Silicon Wafer Upon Electrical Parameters of CMOS Microcircuits. Educational institution «Belarusian State University of Informatics and Radioelectronics», 2024.

MLA (9th ed.) Citation

Pilipenka, U. A., et al. Impact Produced by Recrystallization of Mechanically Destroyed Layer on Planar Side of Silicon Wafer Upon Electrical Parameters of CMOS Microcircuits. Educational institution «Belarusian State University of Informatics and Radioelectronics», 2024.