The Modeling of Electromagnetic Behavior in the High-Frequency Range of Al<sub>2</sub>O<sub>3</sub> and TiO<sub>2</sub> Thermoplastic Composites in Support of Developing New Substrates for Flexible Electronics
The paper describes the simulation of energy absorption in polymer micro-composites that include dielectric inserts (commercial Al<sub>2</sub>O<sub>3</sub> and TiO<sub>2</sub> particles, with three particle sizes of 1, 5 and 25 µm, respectively). The investigated...
Saved in:
| Main Authors: | , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2025-07-01
|
| Series: | Crystals |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2073-4352/15/7/637 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| _version_ | 1839616226847883264 |
|---|---|
| author | Radu F. Damian Cristina Pachiu Alexandra Mocanu Alexandru Trandabat Romeo Cristian Ciobanu |
| author_facet | Radu F. Damian Cristina Pachiu Alexandra Mocanu Alexandru Trandabat Romeo Cristian Ciobanu |
| author_sort | Radu F. Damian |
| collection | DOAJ |
| description | The paper describes the simulation of energy absorption in polymer micro-composites that include dielectric inserts (commercial Al<sub>2</sub>O<sub>3</sub> and TiO<sub>2</sub> particles, with three particle sizes of 1, 5 and 25 µm, respectively). The investigated frequency spectrum, mainly from 0.001 to 100 GHz, is designed for various uses as substrates in electronic technologies. The electromagnetic simulation software chosen was CST Studio Suite, which evaluates the power loss at different frequencies, playing a crucial role in creating the ideal structure of these substrates. The effective limits of the electromagnetic simulation are specified. It is shown that a considerable increase in absorption occurs, by a factor of 12 to 120, depending on the dielectric material used for the inserts and the mass ratio applied in the insertion technique. Dielectrics with high permittivity provide higher absorption, but also create a nonuniform field distribution within the material, resulting in a high peak-to-average absorption ratio. In scenarios where this behavior is intolerable, the technology must be carefully tuned to improve the consistency of the insertions in the substrate material. The final outcomes of the simulations indicated that for creating new substrates for flexible electronics, polyethylene composites with TiO<sub>2</sub> insertions are suggested, particularly at lower concentrations of up to 7% and with a larger radius, such as 25 μm, which could offer significant economic advantages considering that the current concept advises the use of costly particles ranging from nanoscale particles to those 1 μm in size and a composition exceeding 10%. |
| format | Article |
| id | doaj-art-b76b13ab7c2e44e1a4f1b6e922a6e199 |
| institution | Matheson Library |
| issn | 2073-4352 |
| language | English |
| publishDate | 2025-07-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Crystals |
| spelling | doaj-art-b76b13ab7c2e44e1a4f1b6e922a6e1992025-07-25T13:19:15ZengMDPI AGCrystals2073-43522025-07-0115763710.3390/cryst15070637The Modeling of Electromagnetic Behavior in the High-Frequency Range of Al<sub>2</sub>O<sub>3</sub> and TiO<sub>2</sub> Thermoplastic Composites in Support of Developing New Substrates for Flexible ElectronicsRadu F. Damian0Cristina Pachiu1Alexandra Mocanu2Alexandru Trandabat3Romeo Cristian Ciobanu4Department of Electrical Measurements and Materials, Gheorghe Asachi Technical University, 700050 Iasi, RomaniaNational Institute for Research and Development in Microtechnologies (IMT Bucharest), 126A Erou Iancu Nicolae Street, 077190 Voluntari, RomaniaNational Institute for Research and Development in Microtechnologies (IMT Bucharest), 126A Erou Iancu Nicolae Street, 077190 Voluntari, RomaniaDepartment of Electrical Measurements and Materials, Gheorghe Asachi Technical University, 700050 Iasi, RomaniaDepartment of Electrical Measurements and Materials, Gheorghe Asachi Technical University, 700050 Iasi, RomaniaThe paper describes the simulation of energy absorption in polymer micro-composites that include dielectric inserts (commercial Al<sub>2</sub>O<sub>3</sub> and TiO<sub>2</sub> particles, with three particle sizes of 1, 5 and 25 µm, respectively). The investigated frequency spectrum, mainly from 0.001 to 100 GHz, is designed for various uses as substrates in electronic technologies. The electromagnetic simulation software chosen was CST Studio Suite, which evaluates the power loss at different frequencies, playing a crucial role in creating the ideal structure of these substrates. The effective limits of the electromagnetic simulation are specified. It is shown that a considerable increase in absorption occurs, by a factor of 12 to 120, depending on the dielectric material used for the inserts and the mass ratio applied in the insertion technique. Dielectrics with high permittivity provide higher absorption, but also create a nonuniform field distribution within the material, resulting in a high peak-to-average absorption ratio. In scenarios where this behavior is intolerable, the technology must be carefully tuned to improve the consistency of the insertions in the substrate material. The final outcomes of the simulations indicated that for creating new substrates for flexible electronics, polyethylene composites with TiO<sub>2</sub> insertions are suggested, particularly at lower concentrations of up to 7% and with a larger radius, such as 25 μm, which could offer significant economic advantages considering that the current concept advises the use of costly particles ranging from nanoscale particles to those 1 μm in size and a composition exceeding 10%.https://www.mdpi.com/2073-4352/15/7/637polymeric micro-compositesceramic dielectric insertionshigh frequency domainNicolson–Ross–Weir procedure in infinite mediaS-parametersabsorbed energy |
| spellingShingle | Radu F. Damian Cristina Pachiu Alexandra Mocanu Alexandru Trandabat Romeo Cristian Ciobanu The Modeling of Electromagnetic Behavior in the High-Frequency Range of Al<sub>2</sub>O<sub>3</sub> and TiO<sub>2</sub> Thermoplastic Composites in Support of Developing New Substrates for Flexible Electronics Crystals polymeric micro-composites ceramic dielectric insertions high frequency domain Nicolson–Ross–Weir procedure in infinite media S-parameters absorbed energy |
| title | The Modeling of Electromagnetic Behavior in the High-Frequency Range of Al<sub>2</sub>O<sub>3</sub> and TiO<sub>2</sub> Thermoplastic Composites in Support of Developing New Substrates for Flexible Electronics |
| title_full | The Modeling of Electromagnetic Behavior in the High-Frequency Range of Al<sub>2</sub>O<sub>3</sub> and TiO<sub>2</sub> Thermoplastic Composites in Support of Developing New Substrates for Flexible Electronics |
| title_fullStr | The Modeling of Electromagnetic Behavior in the High-Frequency Range of Al<sub>2</sub>O<sub>3</sub> and TiO<sub>2</sub> Thermoplastic Composites in Support of Developing New Substrates for Flexible Electronics |
| title_full_unstemmed | The Modeling of Electromagnetic Behavior in the High-Frequency Range of Al<sub>2</sub>O<sub>3</sub> and TiO<sub>2</sub> Thermoplastic Composites in Support of Developing New Substrates for Flexible Electronics |
| title_short | The Modeling of Electromagnetic Behavior in the High-Frequency Range of Al<sub>2</sub>O<sub>3</sub> and TiO<sub>2</sub> Thermoplastic Composites in Support of Developing New Substrates for Flexible Electronics |
| title_sort | modeling of electromagnetic behavior in the high frequency range of al sub 2 sub o sub 3 sub and tio sub 2 sub thermoplastic composites in support of developing new substrates for flexible electronics |
| topic | polymeric micro-composites ceramic dielectric insertions high frequency domain Nicolson–Ross–Weir procedure in infinite media S-parameters absorbed energy |
| url | https://www.mdpi.com/2073-4352/15/7/637 |
| work_keys_str_mv | AT radufdamian themodelingofelectromagneticbehaviorinthehighfrequencyrangeofalsub2subosub3subandtiosub2subthermoplasticcompositesinsupportofdevelopingnewsubstratesforflexibleelectronics AT cristinapachiu themodelingofelectromagneticbehaviorinthehighfrequencyrangeofalsub2subosub3subandtiosub2subthermoplasticcompositesinsupportofdevelopingnewsubstratesforflexibleelectronics AT alexandramocanu themodelingofelectromagneticbehaviorinthehighfrequencyrangeofalsub2subosub3subandtiosub2subthermoplasticcompositesinsupportofdevelopingnewsubstratesforflexibleelectronics AT alexandrutrandabat themodelingofelectromagneticbehaviorinthehighfrequencyrangeofalsub2subosub3subandtiosub2subthermoplasticcompositesinsupportofdevelopingnewsubstratesforflexibleelectronics AT romeocristianciobanu themodelingofelectromagneticbehaviorinthehighfrequencyrangeofalsub2subosub3subandtiosub2subthermoplasticcompositesinsupportofdevelopingnewsubstratesforflexibleelectronics AT radufdamian modelingofelectromagneticbehaviorinthehighfrequencyrangeofalsub2subosub3subandtiosub2subthermoplasticcompositesinsupportofdevelopingnewsubstratesforflexibleelectronics AT cristinapachiu modelingofelectromagneticbehaviorinthehighfrequencyrangeofalsub2subosub3subandtiosub2subthermoplasticcompositesinsupportofdevelopingnewsubstratesforflexibleelectronics AT alexandramocanu modelingofelectromagneticbehaviorinthehighfrequencyrangeofalsub2subosub3subandtiosub2subthermoplasticcompositesinsupportofdevelopingnewsubstratesforflexibleelectronics AT alexandrutrandabat modelingofelectromagneticbehaviorinthehighfrequencyrangeofalsub2subosub3subandtiosub2subthermoplasticcompositesinsupportofdevelopingnewsubstratesforflexibleelectronics AT romeocristianciobanu modelingofelectromagneticbehaviorinthehighfrequencyrangeofalsub2subosub3subandtiosub2subthermoplasticcompositesinsupportofdevelopingnewsubstratesforflexibleelectronics |