APA (7th ed.) Citation

Silva, V., Colmiais, I., Dinis, H., Borme, J., Alpuim, P., & Mendes, P. M. (2025). Wafer-Level Fabrication of Radiofrequency Devices Featuring 2D Materials Integration. MDPI AG.

Chicago Style (17th ed.) Citation

Silva, Vitor, Ivo Colmiais, Hugo Dinis, Jérôme Borme, Pedro Alpuim, and Paulo M. Mendes. Wafer-Level Fabrication of Radiofrequency Devices Featuring 2D Materials Integration. MDPI AG, 2025.

MLA (9th ed.) Citation

Silva, Vitor, et al. Wafer-Level Fabrication of Radiofrequency Devices Featuring 2D Materials Integration. MDPI AG, 2025.