Effects of strain rate and temperature on the interface deformation mechanism of Cu/Al4Cu9/Al2Cu/Al multilayer composites: A molecular dynamic study
This study employed molecular dynamics simulations to investigate the effects of strain rate and temperature on the interface deformation mechanisms of Cu/Al4Cu9/Al2Cu/Al multilayer composites under uniaxial tensile loading. Results revealed that the microscopic plastic deformation mechanisms and me...
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| Format: | Article |
| Language: | English |
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Elsevier
2025-07-01
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| Series: | Journal of Materials Research and Technology |
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| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785425017557 |
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| author | Hui Zhang Aiqin Wang Aiqiong Pan Jingpei Xie |
| author_facet | Hui Zhang Aiqin Wang Aiqiong Pan Jingpei Xie |
| author_sort | Hui Zhang |
| collection | DOAJ |
| description | This study employed molecular dynamics simulations to investigate the effects of strain rate and temperature on the interface deformation mechanisms of Cu/Al4Cu9/Al2Cu/Al multilayer composites under uniaxial tensile loading. Results revealed that the microscopic plastic deformation mechanisms and mechanical properties were highly sensitive to temperature and strain rate. While the strain rate negligibly influenced the Young's modulus, higher rates enhanced both tensile strength and fracture strain. Conversely, elevated temperatures gradually reduced Young's modulus, tensile strength, and fracture strain.Given the similar deformation processes across conditions, a representative model (300 K, strain rate 10−9/s) was selected for detailed interface deformation analysis.The primary deformation mechanism involved confined dislocation slip and twinning within layers. The Al2Cu layer exhibited localized strain concentration, initiating crack propagation, whereas the Al4Cu9 layer demonstrated dislocation slip and superior cooperative deformation capability. Increased strain rates promoted dislocation accumulation, strengthening deformation resistance, while higher temperatures reduced dislocation density, weakening interfacial bonding and ductility.These findings provide theoretical guidance for optimizing copper-aluminum composites in engineering applications. |
| format | Article |
| id | doaj-art-9a9f9f811226468c8670a80f9405e3f6 |
| institution | Matheson Library |
| issn | 2238-7854 |
| language | English |
| publishDate | 2025-07-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Journal of Materials Research and Technology |
| spelling | doaj-art-9a9f9f811226468c8670a80f9405e3f62025-07-17T04:44:31ZengElsevierJournal of Materials Research and Technology2238-78542025-07-013744074416Effects of strain rate and temperature on the interface deformation mechanism of Cu/Al4Cu9/Al2Cu/Al multilayer composites: A molecular dynamic studyHui Zhang0Aiqin Wang1Aiqiong Pan2Jingpei Xie3School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang, 471023, PR ChinaSchool of Materials Science and Engineering, Henan University of Science and Technology, Luoyang, 471023, PR China; Provincial and Ministerial Co-construction of Collaborative Innovation Center for Non-ferrous Metal New Materials and Advanced Processing Technology, Luoyang, 471023, PR China; Corresponding author. School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang, 471023, PR ChinaSchool of Materials Science and Engineering, Henan University of Science and Technology, Luoyang, 471023, PR ChinaSchool of Materials Science and Engineering, Henan University of Science and Technology, Luoyang, 471023, PR China; Provincial and Ministerial Co-construction of Collaborative Innovation Center for Non-ferrous Metal New Materials and Advanced Processing Technology, Luoyang, 471023, PR ChinaThis study employed molecular dynamics simulations to investigate the effects of strain rate and temperature on the interface deformation mechanisms of Cu/Al4Cu9/Al2Cu/Al multilayer composites under uniaxial tensile loading. Results revealed that the microscopic plastic deformation mechanisms and mechanical properties were highly sensitive to temperature and strain rate. While the strain rate negligibly influenced the Young's modulus, higher rates enhanced both tensile strength and fracture strain. Conversely, elevated temperatures gradually reduced Young's modulus, tensile strength, and fracture strain.Given the similar deformation processes across conditions, a representative model (300 K, strain rate 10−9/s) was selected for detailed interface deformation analysis.The primary deformation mechanism involved confined dislocation slip and twinning within layers. The Al2Cu layer exhibited localized strain concentration, initiating crack propagation, whereas the Al4Cu9 layer demonstrated dislocation slip and superior cooperative deformation capability. Increased strain rates promoted dislocation accumulation, strengthening deformation resistance, while higher temperatures reduced dislocation density, weakening interfacial bonding and ductility.These findings provide theoretical guidance for optimizing copper-aluminum composites in engineering applications.http://www.sciencedirect.com/science/article/pii/S2238785425017557Cu/Al4Cu9/Al2Cu/AlInterfaceDeformation mechanismMolecular dynamicsStrain rate and temperature |
| spellingShingle | Hui Zhang Aiqin Wang Aiqiong Pan Jingpei Xie Effects of strain rate and temperature on the interface deformation mechanism of Cu/Al4Cu9/Al2Cu/Al multilayer composites: A molecular dynamic study Journal of Materials Research and Technology Cu/Al4Cu9/Al2Cu/Al Interface Deformation mechanism Molecular dynamics Strain rate and temperature |
| title | Effects of strain rate and temperature on the interface deformation mechanism of Cu/Al4Cu9/Al2Cu/Al multilayer composites: A molecular dynamic study |
| title_full | Effects of strain rate and temperature on the interface deformation mechanism of Cu/Al4Cu9/Al2Cu/Al multilayer composites: A molecular dynamic study |
| title_fullStr | Effects of strain rate and temperature on the interface deformation mechanism of Cu/Al4Cu9/Al2Cu/Al multilayer composites: A molecular dynamic study |
| title_full_unstemmed | Effects of strain rate and temperature on the interface deformation mechanism of Cu/Al4Cu9/Al2Cu/Al multilayer composites: A molecular dynamic study |
| title_short | Effects of strain rate and temperature on the interface deformation mechanism of Cu/Al4Cu9/Al2Cu/Al multilayer composites: A molecular dynamic study |
| title_sort | effects of strain rate and temperature on the interface deformation mechanism of cu al4cu9 al2cu al multilayer composites a molecular dynamic study |
| topic | Cu/Al4Cu9/Al2Cu/Al Interface Deformation mechanism Molecular dynamics Strain rate and temperature |
| url | http://www.sciencedirect.com/science/article/pii/S2238785425017557 |
| work_keys_str_mv | AT huizhang effectsofstrainrateandtemperatureontheinterfacedeformationmechanismofcual4cu9al2cualmultilayercompositesamoleculardynamicstudy AT aiqinwang effectsofstrainrateandtemperatureontheinterfacedeformationmechanismofcual4cu9al2cualmultilayercompositesamoleculardynamicstudy AT aiqiongpan effectsofstrainrateandtemperatureontheinterfacedeformationmechanismofcual4cu9al2cualmultilayercompositesamoleculardynamicstudy AT jingpeixie effectsofstrainrateandtemperatureontheinterfacedeformationmechanismofcual4cu9al2cualmultilayercompositesamoleculardynamicstudy |