APA (7th ed.) Citation

Alemoush, Z., Almohammad, M., Li, J., Lin, J. Y., & Jiang, H. X. (2025). Development of 6-inch h-BN thick wafers. AIP Publishing LLC.

Chicago Style (17th ed.) Citation

Alemoush, Z., M. Almohammad, J. Li, J. Y. Lin, and H. X. Jiang. Development of 6-inch H-BN Thick Wafers. AIP Publishing LLC, 2025.

MLA (9th ed.) Citation

Alemoush, Z., et al. Development of 6-inch H-BN Thick Wafers. AIP Publishing LLC, 2025.