Novel silicon and GaAs sensors for compact sampling calorimeters
Abstract Two samples of silicon pad sensors and two samples of GaAs sensors are studied in an electron beam with 5 GeV energy from the DESY-II test-beam facility. The sizes of the silicon and GaAs sensors are about 9 $$\times $$ × 9 $$\hbox {cm}^2$$ cm 2 and 5 $$\times $$ × 8 $$\hbox {cm}^2$$ cm 2...
Saved in:
Main Authors: | , , , , , , , , , , , , , , , , , , , , , |
---|---|
Format: | Article |
Language: | English |
Published: |
SpringerOpen
2025-06-01
|
Series: | European Physical Journal C: Particles and Fields |
Online Access: | https://doi.org/10.1140/epjc/s10052-025-14341-4 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Summary: | Abstract Two samples of silicon pad sensors and two samples of GaAs sensors are studied in an electron beam with 5 GeV energy from the DESY-II test-beam facility. The sizes of the silicon and GaAs sensors are about 9 $$\times $$ × 9 $$\hbox {cm}^2$$ cm 2 and 5 $$\times $$ × 8 $$\hbox {cm}^2$$ cm 2 , respectively. The thickness is 500 µm for both the silicon and GaAs sensors. The pad size is about 5 $$\times $$ × 5 $$\hbox {mm}^2$$ mm 2 . The sensors are foreseen to be used in a compact electromagnetic sampling calorimeter. The readout of the pads is done via traces connected to the pads and the front-end ASICs at the edges of the sensors. For the silicon sensors, copper traces on a Kapton foil are connected to the sensor pads with conducting glue. The pads of the GaAs sensors are connected to bond-pads via aluminium traces on the sensor substrate. The readout is based on a dedicated front-end ASIC, called FLAME. Pre-processing of the raw data and deconvolution is performed with FPGAs. The whole system is orchestrated by a Trigger Logic Unit. Results are shown for the signal-to-noise ratio, the homogeneity of the response, edge effects on pads, cross talk and wrongly assigned signals due to the readout traces. |
---|---|
ISSN: | 1434-6052 |