APA (7th ed.) Citation

Qu, K., Chen, K., Zhao, J., Zhang, N., Hu, Q., Zhao, J., . . . Feng, Y. (2023). An electromechanically reconfigurable intelligent surface for enhancing sub-6G wireless communication signal. KeAi Communications Co., Ltd.

Chicago Style (17th ed.) Citation

Qu, Kai, Ke Chen, Jianmin Zhao, Na Zhang, Qi Hu, Junming Zhao, Tian Jiang, and Yijun Feng. An Electromechanically Reconfigurable Intelligent Surface for Enhancing Sub-6G Wireless Communication Signal. KeAi Communications Co., Ltd, 2023.

MLA (9th ed.) Citation

Qu, Kai, et al. An Electromechanically Reconfigurable Intelligent Surface for Enhancing Sub-6G Wireless Communication Signal. KeAi Communications Co., Ltd, 2023.