APA (7th ed.) Citation

Gu, C., Hu, X., Yan, X., Chen, W., Chen, J., Lu, K., . . . Fan, J. (2025). Interconnection mechanism and strengthening behavior of nano-silver sintered joints for silicon carbide power module packaging: A combined EBSD and nanoindentation study. Elsevier.

Chicago Style (17th ed.) Citation

Gu, Chao, Xiao Hu, Xuyang Yan, Wei Chen, Junwei Chen, Kai Lu, Tao Wang, Guoqi Zhang, and Jiajie Fan. Interconnection Mechanism and Strengthening Behavior of Nano-silver Sintered Joints for Silicon Carbide Power Module Packaging: A Combined EBSD and Nanoindentation Study. Elsevier, 2025.

MLA (9th ed.) Citation

Gu, Chao, et al. Interconnection Mechanism and Strengthening Behavior of Nano-silver Sintered Joints for Silicon Carbide Power Module Packaging: A Combined EBSD and Nanoindentation Study. Elsevier, 2025.