Study on Vacuum Brazing Technology of Polycrystalline Diamond and High Speed Steel
In order to realize the connection between polycrystalline diamond (PCD) and high speed steel, Ag-Cu-Ti-In solder was used for vacuum brazing. The brazing temperature, heating current and holding time were selected as experimental factors by Box-Behnken response surface method. The microhardness of...
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| Main Author: | |
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| Format: | Article |
| Language: | Chinese |
| Published: |
Editorial Department of Materials Protection
2021-07-01
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| Series: | Cailiao Baohu |
| Subjects: | |
| Online Access: | http://www.mat-pro.com/fileup/1001-1560/PDF/20210720.pdf |
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| Summary: | In order to realize the connection between polycrystalline diamond (PCD) and high speed steel, Ag-Cu-Ti-In solder was used for vacuum brazing. The brazing temperature, heating current and holding time were selected as experimental factors by Box-Behnken response surface method. The microhardness of post weld solder layer and the spreading area of solder on the surface of PCD were used as response indexes to optimize the brazing process parameters. Then, the vacuum brazing experiments of PCD tool and high speed steel were carried out with optimized process parameters. Finally, the microhardness of post weld solder layer, microstructure of bonding interface and distribution of solder elements were analyzed by microhardness tester, three-dimensional digital microscope and energy dispersive spectrometer. Results showed that element diffusion occurred between Ag-Cu-Ti-In solder and PCD, and the connection between PCD and high speed steel was realized. The optimal brazing parameters were as follows: brazing temperature 900 ℃, heating current 500 A and holding time 13 s. |
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| ISSN: | 1001-1560 |