APA (7th ed.) Citation

Wang, Z., Xu, J., Wu, Q., Shang, S., Shao, W., Huang, J., . . . Yang, J. (2025). Comprehensive enhancement of mechanical strength, thermal conductivity, and oxidation resistance of W/Cu diffusion bonding joint via heterogeneous interface configuration theoretical design. Elsevier.

Chicago Style (17th ed.) Citation

Wang, Zida, et al. Comprehensive Enhancement of Mechanical Strength, Thermal Conductivity, and Oxidation Resistance of W/Cu Diffusion Bonding Joint via Heterogeneous Interface Configuration Theoretical Design. Elsevier, 2025.

MLA (9th ed.) Citation

Wang, Zida, et al. Comprehensive Enhancement of Mechanical Strength, Thermal Conductivity, and Oxidation Resistance of W/Cu Diffusion Bonding Joint via Heterogeneous Interface Configuration Theoretical Design. Elsevier, 2025.