Time-Domain ADC and Security Co-Design for SiP-Based Wireless SAW Sensor Readers
The signal-processing architecture of passive surface acoustic wave (SAW) sensors presents significant implementation challenges due to its radar-like operational principle and the inherent complexity of discrete component-based hardware design. While System-in-Package (SiP) has demonstrated remarka...
Saved in:
| Main Authors: | , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2025-07-01
|
| Series: | Sensors |
| Subjects: | |
| Online Access: | https://www.mdpi.com/1424-8220/25/14/4308 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Summary: | The signal-processing architecture of passive surface acoustic wave (SAW) sensors presents significant implementation challenges due to its radar-like operational principle and the inherent complexity of discrete component-based hardware design. While System-in-Package (SiP) has demonstrated remarkable success in miniaturizing electronic systems for smartphones, automotive electronics, and IoT applications, its potential for revolutionizing SAW sensor interrogator design remains underexplored. This paper presents a novel architecture that synergistically combines time-domain ADC design with SiP-based miniaturization to achieve unprecedented simplification of SAW sensor readout systems. The proposed time-domain ADC incorporates an innovative delay chain calibration methodology that integrates physical unclonable function (PUF) principles during time-to-digital converter (TDC) characterization, enabling the simultaneous generation of unique system IDs. The experimental results demonstrate that the integrated security mechanism provides variable-length bit entropy for device authentication, and has a reliability of 97.56 and uniqueness of 49.43, with 53.28 uniformity, effectively addressing vulnerability concerns in distributed sensor networks. The proposed SiP is especially suitable for space-constrained IoT applications requiring robust physical-layer security. This work advances the state-of-the-art wireless sensor interfaces by demonstrating how time-domain signal processing and advanced packaging technologies can be co-optimized to address performance and security challenges in next-generation sensor systems. |
|---|---|
| ISSN: | 1424-8220 |