Design of a new type of self-destruct chip monitoring and execution circuit
In the current self-destruction technology, the self-destruction monitoring method is single, the self-destruction execution is long, and the self-destruction is incomplete and unstable, which leads to the low success rate of self-destruction. A real-time monitoring and execution circuit system with...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | Chinese |
| Published: |
National Computer System Engineering Research Institute of China
2022-02-01
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| Series: | Dianzi Jishu Yingyong |
| Subjects: | |
| Online Access: | http://www.chinaaet.com/article/3000146228 |
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| Summary: | In the current self-destruction technology, the self-destruction monitoring method is single, the self-destruction execution is long, and the self-destruction is incomplete and unstable, which leads to the low success rate of self-destruction. A real-time monitoring and execution circuit system with both self-destruction monitoring and execution is designed. The circuit system designed two self-destruct monitoring methods, packaging and disassembly and power-on timing, which made the self-destruct monitoring methods more diverse and the results more accurate. At the same time, MOS tube was used as the switching characteristic to reduce the time of self-destruct execution. The experimental results show that the circuit system can carry out real-time monitoring of the working chip through the self-destruct monitoring circuit when the supply voltage is 3.3 V and the storage voltage of tantalum capacitor is 20 V. Meanwhile, the test results show that the time from the monitoring to the self-destruct signal to the start of the self-destruct execution is 0.28 ms. |
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| ISSN: | 0258-7998 |