Rudnik, E. (2025). Electrochemical and Electroless Deposition of High-Entropy Alloy Thin Films: A Review of Plating Conditions, Properties, and Applications. MDPI AG.
Chicago Style (17th ed.) CitationRudnik, Ewa. Electrochemical and Electroless Deposition of High-Entropy Alloy Thin Films: A Review of Plating Conditions, Properties, and Applications. MDPI AG, 2025.
MLA (9th ed.) CitationRudnik, Ewa. Electrochemical and Electroless Deposition of High-Entropy Alloy Thin Films: A Review of Plating Conditions, Properties, and Applications. MDPI AG, 2025.
Warning: These citations may not always be 100% accurate.