Hybrid-Integrated Multi-Lines Optical-Phased-Array Chip

Hybrid-Integrated Multi-Lines Optical-Phased-Array Chip

We propose a hybrid-integrated III–V-silicon optical-phased-array (OPA) based on passive alignment flip–chip bonding technology and provide new solutions for LiDAR. To achieve a large range of vertical beam steering in a hybrid-integrated OPA, a multi-lines OPA in a single chip is introduced. The sy...

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Bibliographic Details
Main Authors: Shengmin Zhou, Mingjin Wang, Jingxuan Chen, Zhaozheng Yi, Jiahao Si, Wanhua Zheng
Format: Article
Language:English
Published: MDPI AG 2025-07-01
Series:Photonics
Subjects:
optical phased array
silicon photonics
hybrid integration
Online Access:https://www.mdpi.com/2304-6732/12/7/699
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