Hybrid-Integrated Multi-Lines Optical-Phased-Array Chip
We propose a hybrid-integrated III–V-silicon optical-phased-array (OPA) based on passive alignment flip–chip bonding technology and provide new solutions for LiDAR. To achieve a large range of vertical beam steering in a hybrid-integrated OPA, a multi-lines OPA in a single chip is introduced. The sy...
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| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2025-07-01
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| Series: | Photonics |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2304-6732/12/7/699 |
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| Summary: | We propose a hybrid-integrated III–V-silicon optical-phased-array (OPA) based on passive alignment flip–chip bonding technology and provide new solutions for LiDAR. To achieve a large range of vertical beam steering in a hybrid-integrated OPA, a multi-lines OPA in a single chip is introduced. The system allows parallel hybrid integration of multiple dies onto a single wafer, achieving a multi-fold improvement in tuning efficiency. In order to increase the range of horizontal beam steering, we propose a half-wavelength pitch waveguide emitter with non-uniform width to reduce the crosstalk, which can remove the higher-order grating lobes in free space. In this work, we simulate OPA individually for four-lines and eight-lines. As a result, we simultaneously achieved a beam steering with nearly ±90° (horizontal) × 17.2° (vertical, when four-line OPA) or 39.6° (vertical, when eight-line OPA) field of view (FOV) and a high tuning efficiency with 1.13°/nm (when eight-line OPA). |
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| ISSN: | 2304-6732 |