Development of Low-Dielectric Modified Polyimide with Low-Temperature Radical Curing for High-Frequency Flexible Printed Circuit Boards
This study presents the development of a modified polyimide (MPI) with low dielectric properties and low-temperature curing capability for high-frequency flexible printed circuit boards (FPCBs). MPI was cured using dicumyl peroxide (DCP) at 80–140 °C through a radical process optimized via DSC analy...
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| Format: | Article |
| Language: | English |
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MDPI AG
2025-05-01
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| Series: | Micro |
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| Online Access: | https://www.mdpi.com/2673-8023/5/2/23 |
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| author | Seonwoo Kim Suin Chae Mirae Seo Yubin Kim Soobin Park Sehoon Park Hyunjin Nam |
| author_facet | Seonwoo Kim Suin Chae Mirae Seo Yubin Kim Soobin Park Sehoon Park Hyunjin Nam |
| author_sort | Seonwoo Kim |
| collection | DOAJ |
| description | This study presents the development of a modified polyimide (MPI) with low dielectric properties and low-temperature curing capability for high-frequency flexible printed circuit boards (FPCBs). MPI was cured using dicumyl peroxide (DCP) at 80–140 °C through a radical process optimized via DSC analysis, while Fourier-transform infrared (FT-IR) confirmed the elimination of C=C bonds and the formation of imide structures. The MPI film exhibited low dielectric constants (D<sub>k</sub>) of 1.759 at 20 GHz and 1.734 at 28 GHz, with ultra-low dissipation factors (D<sub>f</sub>) of 0.00165 and 0.00157. High-frequency S-parameter evaluations showed an excellent performance, with S11 of −32.92 dB and S21 of approximately −1 dB. Mechanical reliability tests demonstrated a strong peel strength of 0.8–1.2 kgf/mm (IPC TM-650 2.4.8 standard) and stable electrical resistance during bending to ~6 mm radius, with full recovery after severe deformation. These results highlight MPI’s potential as a high-performance dielectric material for next-generation FPCBs, combining superior electrical performance, mechanical flexibility, and compatibility with low-temperature processing. |
| format | Article |
| id | doaj-art-6207c0bf788a4ad5be4f16e98a96221a |
| institution | Matheson Library |
| issn | 2673-8023 |
| language | English |
| publishDate | 2025-05-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Micro |
| spelling | doaj-art-6207c0bf788a4ad5be4f16e98a96221a2025-06-25T14:11:12ZengMDPI AGMicro2673-80232025-05-01522310.3390/micro5020023Development of Low-Dielectric Modified Polyimide with Low-Temperature Radical Curing for High-Frequency Flexible Printed Circuit BoardsSeonwoo Kim0Suin Chae1Mirae Seo2Yubin Kim3Soobin Park4Sehoon Park5Hyunjin Nam6ICT Device Packaging Research Center, Korea Electronics Technology Institute (KETI), Seongnam 13509, Republic of KoreaICT Device Packaging Research Center, Korea Electronics Technology Institute (KETI), Seongnam 13509, Republic of KoreaICT Device Packaging Research Center, Korea Electronics Technology Institute (KETI), Seongnam 13509, Republic of KoreaICT Device Packaging Research Center, Korea Electronics Technology Institute (KETI), Seongnam 13509, Republic of KoreaICT Device Packaging Research Center, Korea Electronics Technology Institute (KETI), Seongnam 13509, Republic of KoreaICT Device Packaging Research Center, Korea Electronics Technology Institute (KETI), Seongnam 13509, Republic of KoreaICT Device Packaging Research Center, Korea Electronics Technology Institute (KETI), Seongnam 13509, Republic of KoreaThis study presents the development of a modified polyimide (MPI) with low dielectric properties and low-temperature curing capability for high-frequency flexible printed circuit boards (FPCBs). MPI was cured using dicumyl peroxide (DCP) at 80–140 °C through a radical process optimized via DSC analysis, while Fourier-transform infrared (FT-IR) confirmed the elimination of C=C bonds and the formation of imide structures. The MPI film exhibited low dielectric constants (D<sub>k</sub>) of 1.759 at 20 GHz and 1.734 at 28 GHz, with ultra-low dissipation factors (D<sub>f</sub>) of 0.00165 and 0.00157. High-frequency S-parameter evaluations showed an excellent performance, with S11 of −32.92 dB and S21 of approximately −1 dB. Mechanical reliability tests demonstrated a strong peel strength of 0.8–1.2 kgf/mm (IPC TM-650 2.4.8 standard) and stable electrical resistance during bending to ~6 mm radius, with full recovery after severe deformation. These results highlight MPI’s potential as a high-performance dielectric material for next-generation FPCBs, combining superior electrical performance, mechanical flexibility, and compatibility with low-temperature processing.https://www.mdpi.com/2673-8023/5/2/23low-dielectric polyimideFPCBhigh-frequency electronicslow-temperature curing |
| spellingShingle | Seonwoo Kim Suin Chae Mirae Seo Yubin Kim Soobin Park Sehoon Park Hyunjin Nam Development of Low-Dielectric Modified Polyimide with Low-Temperature Radical Curing for High-Frequency Flexible Printed Circuit Boards Micro low-dielectric polyimide FPCB high-frequency electronics low-temperature curing |
| title | Development of Low-Dielectric Modified Polyimide with Low-Temperature Radical Curing for High-Frequency Flexible Printed Circuit Boards |
| title_full | Development of Low-Dielectric Modified Polyimide with Low-Temperature Radical Curing for High-Frequency Flexible Printed Circuit Boards |
| title_fullStr | Development of Low-Dielectric Modified Polyimide with Low-Temperature Radical Curing for High-Frequency Flexible Printed Circuit Boards |
| title_full_unstemmed | Development of Low-Dielectric Modified Polyimide with Low-Temperature Radical Curing for High-Frequency Flexible Printed Circuit Boards |
| title_short | Development of Low-Dielectric Modified Polyimide with Low-Temperature Radical Curing for High-Frequency Flexible Printed Circuit Boards |
| title_sort | development of low dielectric modified polyimide with low temperature radical curing for high frequency flexible printed circuit boards |
| topic | low-dielectric polyimide FPCB high-frequency electronics low-temperature curing |
| url | https://www.mdpi.com/2673-8023/5/2/23 |
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