APA (7th ed.) Citation

Kim, S., Chae, S., Seo, M., Kim, Y., Park, S., Park, S., & Nam, H. (2025). Development of Low-Dielectric Modified Polyimide with Low-Temperature Radical Curing for High-Frequency Flexible Printed Circuit Boards. MDPI AG.

Chicago Style (17th ed.) Citation

Kim, Seonwoo, Suin Chae, Mirae Seo, Yubin Kim, Soobin Park, Sehoon Park, and Hyunjin Nam. Development of Low-Dielectric Modified Polyimide with Low-Temperature Radical Curing for High-Frequency Flexible Printed Circuit Boards. MDPI AG, 2025.

MLA (9th ed.) Citation

Kim, Seonwoo, et al. Development of Low-Dielectric Modified Polyimide with Low-Temperature Radical Curing for High-Frequency Flexible Printed Circuit Boards. MDPI AG, 2025.