Through-silicon-via formation of 3D electronic modules by laser radiation
Laser heating is a promising method for through-silicon-via (TSV) formation in assembling highdensity 3D electronic modules due to its high specific energy and local heating ability. Using laser radiation for the formation of TSV makes it possible to reduce its diameter, indirectly incre...
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| Main Authors: | , , |
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| Format: | Article |
| Language: | Russian |
| Published: |
Educational institution «Belarusian State University of Informatics and Radioelectronics»
2021-06-01
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| Series: | Doklady Belorusskogo gosudarstvennogo universiteta informatiki i radioèlektroniki |
| Subjects: | |
| Online Access: | https://doklady.bsuir.by/jour/article/view/3078 |
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