Lightweight Cf/HC–SiBCN composite for multifunctional applications

Carbon fiber composites hold significant promise as electromagnetic wave (EMW)-absorbing materials. However, balancing lightweight materials with excellent mechanical properties, low thermal conductivity, and EMW absorption for multifunctional applications remains challenging. Herein, a novel hydrot...

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Bibliographic Details
Main Authors: Lingyu Yang, Lumeng Wang, Shun Dong, Guiqing Chen, Changqing Hong, Xinghong Zhang, Yanchun Zhou
Format: Article
Language:English
Published: Tsinghua University Press 2025-05-01
Series:Journal of Advanced Ceramics
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Online Access:https://www.sciopen.com/article/10.26599/JAC.2025.9221068
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Summary:Carbon fiber composites hold significant promise as electromagnetic wave (EMW)-absorbing materials. However, balancing lightweight materials with excellent mechanical properties, low thermal conductivity, and EMW absorption for multifunctional applications remains challenging. Herein, a novel hydrothermal carbon (HC)-coated three-dimensional (3D) needled carbon fiber-reinforced silicon–boron carbonitride (Cf/HC–SiBCN) composite was developed via an optimized precursor infiltration and pyrolysis (PIP) process combined with impregnation–filtration. By adjusting the precursor concentration and number of impregnation‒filtration cycles, a hierarchical Cf/HC–SiBCN composite with the density of 0.32 g·cm−3 was obtained, which exhibited remarkable mechanical properties, including flexural strengths of 14.75±0.43 MPa (xy-direction) and 14.45±0.66 MPa (z-direction), along with a compressive strength of 9.36±0.20 MPa (z-direction). It also demonstrated low thermal conductivity (0.145 W·m−1·K−1) and exceptional EMW absorption, with a minimum reflection loss (RLmin) of −58.13 dB and an effective absorption bandwidth (EAB) of 7.38 GHz. Owing to their combination of lightweight, enhanced mechanical properties, low thermal conductivity, and superior EMW absorption capabilities, Cf/HC–SiBCN composites are highly suitable for multifunctional applications.
ISSN:2226-4108
2227-8508