APA (7th ed.) Citation

Li, J., Shen, Y., Tatsumi, H., Kotadia, H., Gao, R., & Nishikawa, H. (2025). Effect of copper on interfacial reaction and microstructure of soldering on aluminum substrate. Elsevier.

Chicago Style (17th ed.) Citation

Li, Jiahui, Yu-An Shen, Hiroaki Tatsumi, Hiren Kotadia, Runhua Gao, and Hiroshi Nishikawa. Effect of Copper on Interfacial Reaction and Microstructure of Soldering on Aluminum Substrate. Elsevier, 2025.

MLA (9th ed.) Citation

Li, Jiahui, et al. Effect of Copper on Interfacial Reaction and Microstructure of Soldering on Aluminum Substrate. Elsevier, 2025.